新聞資訊
歐委會(huì)分別于2009年6月5日和2009年6月11日公布了決議2009/428/EC和決議2009/443/EC兩份新的修訂文件,分別對(duì)RoHS的豁免項(xiàng)目進(jìn)行更新。
2009/428/EC 第22項(xiàng)豁免替換如下:
22.用于光纖通訊系統(tǒng)的稀土鐵石榴石法拉第旋轉(zhuǎn)器中的雜質(zhì)鉛,豁免至2009年12月31日。
2009/423/EC 增加以下第33至38項(xiàng)豁免:
33.電源變壓器中直徑100微米及以下細(xì)銅線所用焊料中的鉛。
34.金屬陶瓷質(zhì)的微調(diào)電位計(jì)中的鉛。
35.專業(yè)音頻設(shè)備上光耦合器中使用的光敏電阻中的鎘,豁免至2009年12月31日止。
36.直流等離子顯示器中陰極濺射抑制劑中的汞,其含量每臺(tái)顯示器不超過30毫克,豁免至2010年7月1日止。
37.基于硼酸鋅玻璃體的高壓二極管的電鍍層中的鉛。
38.鋁結(jié)合氧化鈹?shù)暮衲{料中的鎘和氧化鎘。
更新數(shù)據(jù)來源:http://www.cn.sgs.com/zh/rohs_cn/information-express-cn/enewsletter-2009-cn/new-amendments-to-the-exemption-of-eu-rohs-cn.htm
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New Exempted Items of RoHS Directive
2008年5月24日,歐盟官方公報(bào)發(fā)布決議2008/385/EC,決議內(nèi)容為,
RoHS指令新增3條豁免項(xiàng)目:
30. Cadmium alloys as electrical/mechanical solder joints to electrical conductors
located directly on the voice coil in transducers used in high-powered loudspeakers
with sound pressure levels of 100 dB (A) and more.
30. 用于位于音壓級(jí)(SPL)大于或等于100 分貝的大功率揚(yáng)聲器音圈上的電導(dǎo)體的電氣/機(jī)
械焊點(diǎn)的鎘合金。
31. Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are
used for liquid crystal displays, design or industrial lighting).
31. 用于無汞平板熒光燈(例如:用于液晶顯示器、設(shè)計(jì)或工業(yè)照明)的焊料中的鉛。
32. Lead oxide in seal frit used for making window assemblies for Argon and
Krypton laser tubes.’
32. 用于氬和氪激光管防護(hù)窗組合件的封裝玻璃料里的鉛的氧化物。
自RoHS 指令發(fā)布以來,歐盟委員會(huì)針對(duì)豁免材料陸續(xù)發(fā)布了7 次決議,
分別是: 2005/717/EC 、2005/747/EC 、2006/310/EC 、2006/690/EC 、
2006/691/EC、2006/692/EC 和2008/385/EC,這些決議中的豁免共計(jì)32 項(xiàng)。
第1 項(xiàng)至第29 項(xiàng)豁免如下:
1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.
1. 小型熒光燈中的汞,汞含量不超過5mg/燈。
2 .Mercury in straight fluorescent lamps for general purposes not exceeding:
2. 普通用途直熒光燈中的汞,汞含量不超過:
· Halophosphate 10 mg;
鹽磷酸鹽 10mg.
· Triphosphate with normal lifetime 5 mg;
普通壽命的三磷酸鹽5mg
· Triphosphate with long lifetime 8 mg.
長(zhǎng)壽命的三磷酸鹽8mg
3. Mercury in straight fluorescent lamps for special purposes.
3. 特殊用途直熒光燈中的汞
4 Mercury in other lamps not specifically mentioned in this Annex.
4. 本附錄未明確提出的其他燈具中的汞
5 Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
5. 陰極射線管,電子元件以及熒光管的玻璃中的鉛
6 Lead as an alloying element in:
6. 鉛作為合金元素在:
· Steel containing up to 0.35 % lead by weight;
鋼里,鉛的重量含量不超過0.35 %
· Aluminium containing up to 0.4 % lead by weight;
鋁里,鉛的重量含量不超過0.4%
· Copper alloy containing up to 4 % lead by weight.
銅合金里,鉛的重量含量不超過4%
7 · Lead in high melting temperature type solders (i.e. lead-based alloys containing
85 % by weight or more lead).
7. 用于高溫融化焊料中的鉛(即:錫鉛焊料合金中鉛含量超過85%)
· Lead in solders for servers, storage and storage array systems, network
infrastructure equipment for switching, signalling, transmission as well as network
management for telecommunication.
用于服務(wù)器,存儲(chǔ)器和存儲(chǔ)系統(tǒng)中的鉛,用于交換,信號(hào)和傳輸,以及電信網(wǎng)絡(luò)管理的
網(wǎng)絡(luò)基礎(chǔ)設(shè)施設(shè)備中焊料中的鉛。
· Lead in electronic ceramic parts (e.g. piezoelectronic devices).
電子陶瓷產(chǎn)品中的鉛(如:高壓電子裝置)
8 .Cadmium and its compounds in electrical contacts and cadmium plating except
for applications banned under Directive 91/338/EEC amending Directive
76/769/EEC relating to restrictions on the marketing and use of certain dangerous
substances and preparations.
8. 根據(jù)修改關(guān)于限制特定危險(xiǎn)物質(zhì)和與制品銷售和使用的第76/796/EEC號(hào)指令的
91/338/EEC號(hào)指令禁止以外的鎘電鍍。
9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in
absorption refrigerators.
9. 在吸收式電冰箱中作為碳鋼冷卻系統(tǒng)防腐劑的六價(jià)鉻。
9a DecaBDE in polymeric applications.
9a 應(yīng)用于聚合物中的DecaBDE(十溴二苯醚)
[注:2008年4月初,歐洲法院(European Court of Justice)發(fā)布公告:歐盟委員會(huì)2005
年公布的針對(duì)十溴二苯醚的豁免項(xiàng)目存在程序性的錯(cuò)誤,因此廢除委員會(huì)決議2005/717/EC
附件第9a條對(duì)聚合物中十溴二苯醚的豁免,裁定將于2008年7月1日?qǐng)?zhí)行,因此聚合物中十
溴二苯醚的豁免只能延續(xù)至2008年6月30日。]
9b Lead in lead-bronze bearing shells and bushes.
9b 用于鉛銅合金軸承和襯套中的鉛。
11.Lead used in compliant pin connector systems.
11. 順應(yīng)針連接器系統(tǒng)中的鉛。
12.Lead as a coating material for the thermal conduction module c-ring.
12. 用于熱傳導(dǎo)模塊C-環(huán)的被覆材料中的鉛。
13.Lead and cadmium in optical and filter glass.
13. 用于光學(xué)及濾波器玻璃中的鉛和鎘。
14.Lead in solders consisting of more than two elements for the connection
between the pins and the package of microprocessors with a lead content of more
than 80% and less than 85% by weight.
14. 微處理器針腳及封裝聯(lián)接所使用的含兩種以上組分的焊料中的鉛(鉛含量在80%與85%
之間)。
15.Lead in solders to complete a viable electrical connection between
semiconductor die and carrier within integrated circuit Flip Chip packages.
15. 集成電路倒裝芯片封裝中半導(dǎo)體芯片及載體之間形成可靠聯(lián)接所用焊料中的鉛。
16. Lead in linear incandescent lamps with silicate coated tubes.
16. 用于帶有硅酸鹽燈管的線型白熾燈中的鉛。
17. Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for
professional reprography applications.
17. 用在專業(yè)復(fù)印領(lǐng)域高強(qiáng)度放電燈(HID)做激發(fā)介質(zhì)中的鹵素鉛。
18. Lead as activator in the fluorescent powder (1 % lead by weight or less) of
discharge lamps when used as sun tanning lamps containing phosphors such as
BSP (BaSi2O5:Pb) as well as when used as speciality lamps for diazo-printing
reprography, lithography, insect traps, photochemical and curing processes
containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb).
18. 放電管的熒光粉中作為催化劑的鉛(鉛的重量小于等于1%)可以豁免,當(dāng)放電管用于
含有磷元素(如BSP (BaSi2O5:Pb))的日曬燈時(shí),以及用于重氮印刷、平板印刷、捕蟲、
光化學(xué)、固化工藝等等專業(yè)領(lǐng)域的燈具時(shí)。
19. Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam
and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps
(ESL).
19. 小型節(jié)能燈中作為主要汞合金的特定的PbBiSn-Hg 和PbInSn-Hg中的鉛,以及作為輔
助汞合金的PbSn-Hg中的鉛。
20. Lead oxide in glass used for bonding front and rear substrates of flat
fluorescent lamps used for Liquid Crystal Displays (LCD).
20. LCD的平板熒光燈前后基板鍵合時(shí)所用玻璃中的鉛。
21. Lead and cadmium in printing inks for the application of enamels on
borosilicate glass.
21. 用在硅硼玻璃表面瓷釉上的印刷油墨中的鉛和鎘;
22. Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre
optic communications systems.
22. 在光纖通訊系統(tǒng)中的稀土鐵石榴石法拉第旋轉(zhuǎn)器中的雜質(zhì)鉛;
23. Lead in finishes of fine pitch components other than connectors with a pitch of
0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components
other than connectors with a pitch of 0.65 mm or less with copper lead frames.
23. 小螺距零部件表面處理中的鉛(螺距不超過0.65mm且?guī)ф囪F邊框的連接器,以及螺距
不超過0.65mm且?guī)с~邊框的連接器不在豁免之內(nèi))
24. Lead in solders for the soldering to machined through hole discoidal and planar
array ceramic multilayer capacitors.
24. 通過盤狀及平面陳列陶瓷多層電容器的焊料所含的鉛;
25. Lead oxide in plasma display panels (PDP) and surface conduction electron
emitter displays (SED) used in structural elements; notably in the front and rear
glass dielectric layer, the bus electrode, the black stripe, the address electrode, the
barrier ribs, the seal frit and frit ring as well as in print pastes.
25. 等離子顯示屏(PDP)及表面?zhèn)鲗?dǎo)式電子發(fā)射顯示器(SED)構(gòu)件中所用的氧化鉛,特
別是在玻璃前后絕緣層中所用的氧化鉛、總線電極中的氧化鉛、黑條(彩色顯像管)中的氧
化鉛、地址電極中的氧化鉛、阻擋層肋柱的氧化鉛、密封玻璃料中的氧化鉛,以及封裝玻璃
中的氧化鉛、環(huán)狀玻璃中的氧化鉛、印墨中的氧化鉛;
26. Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.
26. 黑藍(lán)燈(BLB)玻璃封裝中的氧化鉛;
27. Lead alloys as solder for transducers used in high-powered (designated to
operate for several hours at acoustic power levels of 125 dB SPL and above)
loudspeakers.
27. 用作大功率揚(yáng)聲器(用在長(zhǎng)時(shí)間操作125分貝以上的音響系統(tǒng))的傳感器中焊料的鉛合
金。
28. Hexavalent chromium in corrosion preventive coatings of unpainted metal
sheetings and fasteners used for corrosion protection and Electromagnetic
Interference Shielding in equipment falling under category three of Directive
2002/96/EC (IT and telecommunications equipment).Exemption granted until 1 July
2007.
28. 用于防腐或屏蔽電磁干擾,用在特定儀器設(shè)備中(歐盟指令2002/96/EC第三類規(guī)定的
IT和通訊設(shè)備)的金屬片或金屬扣件上的防腐涂層中的六價(jià)鉻。這項(xiàng)豁免將于2007年7月1
日停止。
29. Lead bound in crystal glass as defined in Annex I (Categories1, 2, 3 and 4) of
Council Directive 69/493/EEC (*).
29. 水晶玻璃中鉛含量的限定依照歐盟指令69/493/EEC附件Ⅰ(第1、2、3、4類)。
注: 以上豁免項(xiàng)目,若中文譯文與英文原文意思上不一致, 以英文原文為準(zhǔn)
Remark: If the Chinese translation contradicts the English text, the English text will prevail.
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